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 LH532048
FEATURES * 131,072 words x 16 bit organization * Access time: 100 ns (MAX.) * Static operation * TTL compatible I/O * Three-state outputs * Single +5 V power supply * Power consumption: Operating: 412.5 mW (MAX.) Standby: 550 W (MAX.) * Packages: 40-pin, 600-mil DIP 40-pin, 525-mil SOP 44-pin, 650-mil QFJ (PLCC) DESCRIPTION
The LH532048 is a 2M-bit mask-programmable ROM organized as 131,072 x 16 bits. It is fabricated using silicon-gate CMOS process technology.
40-PIN DIP 40-PIN SOP
CMOS 2M (128K x 16) MROM
PIN CONNECTIONS
TOP VIEW
NC CE D15 D14 D13 D12 D11 D10 D9 D8 GND D7 D6 D5 D4 D3 D2 D1 D0 OE
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21
VCC NC A16 A15 A14 A13 A12 A11 A10 A9 GND A8 A7 A6 A5 A4 A3 A2 A1 A0
532048-1
Figure 1. Pin Connections for DIP and SOP Packages
44-PIN PLCC
VCC D13 D14 D15 A16 A15 A14 NC NC NC CE
TOP VIEW
6 D12 D11 D10 D9 D8 GND NC D7 D6 D5 D4 7 8 9 10 11 12 13 14 15 16 17
5
4
3
2
1 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 A13 A12 A11 A10 A9 GND NC A8 A7 A6 A5
18 19 20 21 22 23 24 25 26 27 28
D3 D2 D1 D0 A0 A1 A2 A3 OE NC A4
532048-2
Figure 2. Pin Connections for QFJ (PLCC) Package
1
LH532048
CMOS 2M MROM
A16 38 A15 37 A14 36 A13 35 A12 34
3 D15 MEMORY MATRIX (131,072 x 16) 4 D14 5 D13 6 D12 7 D11 8 D10
OUTPUT BUFFER
A9 A8 A7 A6
31 29 28 27
ADDRESS BUFFER
A11 33 A10 32
ADDRESS DECODER
9 D9 10 D8 12 D7 13 D6 14 D5 15 D4 16 D3 17 D2 18 D1
A5 26 A4 25 A3 24 A2 23 A1 22 A0 21
COLUMN SELECTOR
CE 2
CE BUFFER
TIMING GENERATOR
SENSE AMPLIFIER
19 D0
OE 20
OE BUFFER
40 VCC NOTE: Pin numbers apply to the 40-pin DIP or SOP.
11 30 GND
532048-3
Figure 3. LH532048 Block Diagram
PIN DESCRIPTION
SIGNAL PIN NAME SIGNAL PIN NAME
A0 - A16 D0 - D15 CE OE
Address input Data output Chip enable input Output enable input
VCC GND NC
Power supply (+5 V) Ground No connection
2
CMOS 2M MROM
LH532048
A16 42 A15 41 A14 40 A13 39 A12 38
4 D15 MEMORY MATRIX (131,072 x 16) 5 D14 6 D13 7 D12 8 D11 9 D10
OUTPUT BUFFER
A9 A8 A7 A6
35 32 31 30
ADDRESS BUFFER
A11 37 A10 36
ADDRESS DECODER
10 D9 11 D8 14 D7 15 D6 16 D5 17 D4 18 D3 19 D2 20 D1
A5 29 A4 28 A3 27 A2 26 A1 25 A0 24
COLUMN SELECTOR
CE 3
CE BUFFER
TIMING GENERATOR
SENSE AMPLIFIER
21 D0
OE 22
OE BUFFER
44 VCC NOTE: Pin numbers apply to the 44-pin QFJ.
12 34 GND
532048-4
Figure 4. LH532048 Block Diagram
3
LH532048
CMOS 2M MROM
TRUTH TABLE
CE OE DATA OUTPUT SUPPLY CURRENT
H L L
X H L
High-Z High-Z D0 - D15
Standby Operating Operating
NOTE: X = H or L, High-Z = High-impedance
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL RATING UNIT
Supply voltage Input voltage Output voltage Operating temperature Storage temperature
VCC VIN VOUT Topr Tstg
- 0.3 to +7.0 - 0.3 to V CC + 0.3 - 0.3 to V CC + 0.3 0 to +70 -65 to +150
V V V C C
RECOMMENDED OPERATING CONDITIONS (TA = 0C to +70C)
PARAMETER SYMBOL MIN. TYP. MAX. UNIT
Supply voltage
VCC
4.5
5.0
5.5
V
DC CHARACTERISTICS (VCC = 5 V 10%, TA = 0C to +70C)
PARAMETER SYMBOL CONDITIONS MIN. MAX. UNIT NOTE
Input `High' voltage Input `Low' voltage Output `High' voltage Output `Low' voltage Input leakage current Output leakage current
VIH VIL VOH VOL | ILl | | ILO | ICC1 ICC2 ICC3 ICC4 IOH = - 400 A IOL = 2.0 mA V IN = 0 V to VCC V OUT = 0 V to VCC tRC = 100 ns tRC = 1 s tRC = 100 ns tRC = 1 s CE = V IH CE = V CC - 0.2 V f = 1 MHz TA = 25C
2.2 - 0.3 2.4
VCC + 0.3 0.8
V V V
0.4 10 10 75 65 70 60 3 100 10 10
V A A mA mA mA mA mA A pF pF 1 2 2 3 3
Operating current
Standby current Input capacitance Output capacitance
ISB1 ISB2 CIN COUT
NOTES: 1. CE/OE = VIH 2. VIN = VIH or VIL, CE = VIL, outputs open 3. VIN = (VCC - 0.2 V) or 0.2 V, CE = 0.2 V, outputs open
4
CMOS 2M MROM
LH532048
AC CHARACTERISTICS (VCC = 5 V 10%, TA = 0C to +70C)
PARAMETER SYMBOL MIN. MAX. UNIT NOTE
Read cycle time Address access time Chip enable access time Output enable delay time Output hold time CE to output in High-Z OE to output in High-Z
tRC tAA tACE tOE tOH tCHZ tOHZ
100 100 100 55 0 50
ns ns ns ns ns ns ns 1
NOTE: 1. This is the time required for the outputs to become high-impedance.
AC TEST CONDITIONS
PARAMETER RATING
Input voltage amplitude Input rise/fall time Input/output reference level Output load condition
0.4 V to 2.6 V 10 ns 1.5 V 1 TTL + 100 pF
CAUTION
To stabilize the power supply, it is recommended that a high-frequency bypass capacitor be connected between the VCC pin and the GND pin.
tRC
A0 - A16 tAA (NOTE) CE tACE (NOTE) OE tOE (NOTE) tOHZ tOH tCHZ
D0 - D15 NOTE: The output data becomes valid when the last intervals, tAA, tACE, or tOE, have concluded.
DATA VALID
532048-5
Figure 5. Timing Diagram
5
LH532048
CMOS 2M MROM
PACKAGE DIAGRAMS
40DIP (DIP040-P-0600)
40 21
DETAIL
13.45 [0.530] 12.95 [0.510]
1 52.30 [2.059] 51.70 [2.035]
20
0 TO 15 0.30 [0.012] 0.20 [0.008]
4.55 [0.179] 3.95 [0.156] 5.40 [0.213] 4.80 [0.189] 3.55 [0.140] 2.95 [0.116] 2.54 [0.100] TYP. 0.51 [0.020] MIN. 0.60 [0.024] 0.40 [0.016] MAXIMUM LIMIT MINIMUM LIMIT
15.24 [0.600] TYP.
DIMENSIONS IN MM [INCHES]
40DIP
40-pin, 600-mil DIP
40SOP (SOP040-P-0525)
1.27 [0.050] TYP. 1.40 [0.055] 21
0.50 [0.020] 0.30 [0.012]
40
11.50 [0.453] 11.10 [0.437]
14.50 [0.571] 13.70 [0.539]
12.50 [0.492]
1 26.50 [1.043] 26.10 [1.028]
20 1.40 [0.055] 0.20 [0.008] 0.10 [0.004] 0.15 [0.006] 1.275 [0.050] 2.90 [0.114] 2.50 [0.098] 0.20 [0.008] 0.00 [0.000] 1.275 [0.050] MAXIMUM LIMIT MINIMUM LIMIT
DIMENSIONS IN MM [INCHES]
40SOP
40-pin, 525-mil SOP
6
CMOS 2M MROM
LH532048
44QFJ (QFJ044-P-0650)
1.27 [0.050] TYP. C1.1 5 1 40
10 35 16.60 [0.654] 17.60 [0.693] 17.40 [0.685] 16.00 [0.630] 15.20 [0.598]
15 30 0.56 [0.022] 0.36 [0.014]
20 16.60 [0.654] 17.60 [0.693] 17.40 [0.685]
25 0.85 [0.033] 1.80 [0.071] 0.25 [0.010] 4.60 [0.181] 4.20 [0.165] 2.35 [0.093]
DIMENSIONS IN MM [INCHES]
MAXIMUM LIMIT MINIMUM LIMIT
44QFJ-2
44-pin, 650-mil QFJ (PLCC)
ORDERING INFORMATION
LH532048 Device Type X Package
D 40-pin, 600-mil DIP (DIP040-P-0600) N 40-pin, 525-mil SOP (SOP040-P-0525) U 44-pin, 650-mil QFJ (PLCC) (QFJ044-P-S650) CMOS 2M (128K x 16) Mask-Programmable ROM Example: LH532048D (CMOS 2M (128K x 16) Mask-Programmable ROM, 40-pin, 600-mil DIP)
532048-6
7


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